3D Heterogeneous Integration using AGPT™

ED2 has pioneered the use of fused silica in heterogeneous semiconductor packaging. We call this Advanced Glass Packaging Technology (AGPT™). 

A heterogeneous semiconductor package combines multiple different types of semiconductor materials or technologies within a single package. This can include a combination of materials, such as silicon and compound semiconductors, or a combination of different types of semiconductor devices, such as transistors and diodes.

Heterogeneous semiconductor packages offer several benefits over traditional homogeneous packages, which are made from a single type of semiconductor material or technology. One key benefit is that they allow for the integration of multiple different functions within a single package, which reduces size and complexity of electronic systems. Heterogeneous semiconductor packages improve performance by allowing different functions to be optimized for their respective materials or technologies.

Examples of heterogeneous semiconductor packages include system-in-package (SiP) and multi-chip modules (MCM). These packages are commonly used in a wide range of electronic applications, including smartphones, computer systems, and other consumer and industrial electronics.

  • High temperature Resistance
  • Coefficient of Thermal Expansion (CTE)
  • Low Dielectric Loss
  • Low Outgassing
  • RAD Hard
  • Scalable Manufacturing

mmWave Repeaters

ED2 technology portfolio includes both mmWave and c-band repeaters for 5g cellular communications, for both inside and outside use. ED2 Repeater products have been licensed to Wilson Electrons.

ED2’s repeater technology is capable of taking inbound 5G RF signals from a commercial cellular network, frequently translation to I/F frequency, transmitting via coax cable to a coverage unit (CU), amplifying, and re transmitting.

The benefit of the cellular repeater is to quickly and simply extend the 5G network, and/or fill any coverage gaps created by RF blockers or other obstacles.

360° Coverage ∙ Sub-6GHz 4 H/V Radio Inputs ∙ Software-Defined Switch Matrix


Advanced Antenna System

The FreeStar5G Advance Antenna System was developed by ED2 and licensed to Freefall 5G. The product takes an innovative and disruptive approach to signal distribution. Rather than incorporate 10s to 100s of individual antenna modules onto a large panel, each module tasked and limited to support a single UE, the FF5G approach uses patented dielectric waveguide antenna (DWA) technology to deliver instant coverage across the entire field of users. An integrated switch matrix allows the signals to be switched or directed in any multitude of ways, to support a wide variety of applications.



  • Beam pointing rather than beam forming
  • Wide area coverage
  • No moving parts
  • EIRP +50 dBm
  • SU-MIMO and MU-MIMO ready
  • Built in software-defined Power Control and Beam Steering logic

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