3.8 GHz (cellular C-Band) Fused Silica Bandpass Filter

ED2’s C-band Bandpass Filter is a fused silica (glass) high-performance, low cost, BGA-type surface mount component. The filter typically has a <3 dB insertion loss over a 334 MHz bandwidth. The filter’s excellent rejection makes it a perfect roofing filter in complement to SAW/BAW applications. Filter was specifically designed for cellular c-band applications. This small size filter has minimal variation in performance and is also highly repeatable from filter to filter. The filter is a RoHS-compliant industry-standard device.

Features

• Low Insertion Loss
• Extreme out of band rejection to +18 GHz
• Common footprint up to 10GHz
• Customizable to other frequencies and bandwidths
• Wafer level process (low manufacturing cost)
• Extremely stable over temperature
• Characteristic Impedance: 50Ω
• -55˚C to +125˚C
• Moisture Sensitivity Level: MSL2A
• Surface Mount BGA Package

DATA SHEET HERE

3.6 GHz (CBRS) Fused Silica Bandpass Filter

ED2’s CBRS Bandpass Filter is a fused silica (glass) high-performance, low cost, BGA-type surface mount component. The filter typically has a 3.7 dB insertion loss over a 278 MHz bandwidth. The filter’s excellent rejection makes it a perfect roofing filter in complement to SAW/BAW applications. Filter was specifically designed for n48 CBRS operating band applications. This small size filter has minimal variation in performance and is also highly repeatable from filter to filter. The filter is a RoHS-compliant industry-standard device.

Features

• Low Insertion Loss
• Extreme out of band rejection to +18 GHz
• Common footprint up to 10GHz
• Customizable to other frequencies and bandwidths
• Wafer level process (low manufacturing cost)
• Extremely stable over temperature
• Characteristic Impedance: 50Ω
• -55˚C to +125˚C
• Moisture Sensitivity Level: MSL2A
• Surface Mount BGA Package

DATA SHEET HERE

3D Glass Modules

ED2 Corporation is an emerging technology company located in Tucson, Arizona, USA.

With decades of research and development into the use of glass as a substrate for electronics, ED2’s 3D glass modules are creating paradigm-shifting technology in a variety of markets, including wireless telecom (5G and beyond), space & satcom, medical devices, and radar.

ED2’s glass modules offer the highest level of integration with superior electrical performance, ranging from 1 to 100 GHz. The resulting product is cost-efficient, maximizes volume, and is scalable.

Features

• Up to 100GHz
• Smallest feature size (<20µ lines and spaces)
• High Q lumped components
• Low loss tangent
• Naturally hermetic
• Wafer-level process

Scalable Manufacturing

• 8-inch (200mm) glass wafer fabrication, using standard semiconductor processing equipment.
• Thousands of die on single wafer, chip-scale package from 16mm2 down to <1mm2.
• Roadmap to “System-on-Glass​.” Integrate passives and other structures directly on glass with switches to create ultra-miniaturized RF subsystems.

Benefits

• Through-Glass-Via Packaging
• Reduces size of traditional wire-bond packaging by >60%.
• Compared to silicon, metal-on-glass delivers lowest loss, highest linearity performance.
• Drastically reduced package parasitics to enable designs >50 GHz.
• Hermetically-sealed environment enables the ideal switch to achieve billions of reliable operations.

Talk to us about how we can redesign your existing PCB-based module into to glass to leverage the performance, size, and cost benefits.