ED2 RESOURCES

Advanced Glass Packaging Technology™ (AGPT)

Coefficient of Thermal Expansion and Fused Silica

Dielectric Waveguide Array (DWA™) in the Microwave Journal

Mixer Module

Phased Array Module

Coefficient of Thermal Expansion and Fused Silica

ED2 CORP - GLASS MODULES OVERVIEW

38.5GHz Bandpass Filter

C-Band Bandpass Filter

Coefficient of Thermal Expansion and Fused Silica

ED2 CORP - GLASS MODULES OVERVIEW

38.5GHz Bandpass Filter

28 GHz Band Pass Filter

28 GHz Reference Design (RF Front End)

DC Pass Power Splitter/Combiner 750 – 2,000 MHz

38.5GHz Bandpass Filter

ED2 White Paper: Advanced Glass Packaging Technology™ (AGPT)